SIM card socket and method for manufacturing the same

ABSTRACT

A SIM card socket and method for manufacturing the same. The SIM card socket includes a base, a first engaging member, and a second engaging member. The base includes a first side and a second side opposite thereto. The first engaging member is fixed on the first side of the base. The second engaging member is disposed on the second side of the base in an elastically deformable manner. The manufacturing method includes the following steps. A conductive base with a plurality of protrusions is provided. An isolating member is formed on the conductive base, and the protrusions are partially covered by the isolating member. The protrusions are cut so as to not connect with each other.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a SIM (subscriber identification module) card socket for an electronic device and a manufacturing method thereof, and in particular, to a SIM card socket manufactured by a simplified process.

2. Description of the Related Art

Mobile phones have become so popular that one user may have several mobile phones using one SIM card that may be shared between different mobile phones. A convenient method of removing and installing the SIM card in mobile phone is important. The conventional methods for holding the SIM card can be substantially divided into two types: a fixed type and a moveable type. Since the moveable type is un-related to the invention, its description in omitted.

To fix the SIM card in the SIM card socket, a surface, formed with pads, of the SIM card is firstly aligned with a surface, formed with contacts, of a body of the mobile phone. The SIM card is then pushed to a predetermined position on the body. Furthermore, after a battery thereof is combined with the body of the mobile phone, the SIM card can be fixed by a rib on the battery to prevent dislodging.

The SIM card often cannot be fixed in the conventional SIM card socket without application of another device such as the battery, as above. In view of this, another conventional SIM card socket that can hold the SIM card by itself has been provided. Its structure, however, must be coordinated with a housing of the mobile phone so that the entire process for manufacturing the mobile phone becomes complicated.

SUMMARY OF THE INVENTION

In view of this, the invention provides an electronic device including a SIM card socket with a simplified structure.

Another purpose of the invention is to provide a SIM card socket providing convenience for insertion and removal.

Still another purpose of the invention is to provide a method for manufacturing the SIM card socket using a simplified process

Accordingly, the invention provides a SIM card socket including a base, a first engaging member, and a second engaging member. The base includes a first side and a second side opposite thereto. The first engaging member is fixed on the first side of the base. The second engaging member is disposed on the second side of the base in an elastically deformable manner.

In a preferred embodiment, the second engaging member includes a connecting portion and a holding portion. The connecting portion is connected to the second side of the base. The holding portion is integrally formed on the connecting portion, and may be cantilevered to move relative to the base.

It is noted that the first engaging member and the second engaging member may be integrally formed on the base.

In another preferred embodiment, the SIM card socket further includes an isolation member, a plurality of first elastic members, and a second elastic member. The isolation member is disposed on the base, and may be made of plastic. The first elastic members are disposed in the isolation member respectively. The second elastic member is integrally formed on the base.

In another preferred embodiment, the base further includes a third side, a fourth side, and two walls. The fourth side is opposite to the third side. The walls are formed on the third side and the fourth side respectively.

In the invention, a method for manufacturing a SIM card socket is provided. The method includes the following steps. A conductive base with a plurality of protrusions is provided. An isolating member is formed on the conductive base, and the protrusions are partially covered by the isolating member. The protrusions are cut so as to not connect with each other.

In another preferred embodiment, the method further includes the following step. After the isolation member is formed on the conductive base, the protrusions are press molded into an inverted-V shape.

It is noted that the thickness of the isolation member is adjusted according to an angle at which the protrusion is bent.

In another preferred embodiment, the method further includes the following step. After the isolation member is formed on the conductive base, the conductive base is bent so as to form a first engaging member, a second engaging member, an elastic member, and a wall. The first engaging member, the second engaging member, the elastic member, and the wall are all formed by pressing the base.

In another preferred embodiment, the protrusions are formed in the conductive base by cutting, extending in the same direction thereon. Alternatively, part of the protrusions extends in a first direction, and the other part of the protrusions extends in a second direction opposite to the first direction.

It is noted that the isolation member is disposed on the conductive base by injection molding.

In the invention, an electronic device is provided. The electronic device includes a body, a SIM card socket, and a SIM card. The body includes a connector, and the SIM card socket is disposed on the body. The SIM card is disposed in the SIM card socket in a manner such that the SIM card is coupled to the connector. The SIM card socket includes a base, a first engaging member, and a second engaging member. The base includes a hollow portion, a first side, and a second side opposite to the first side. The connector is connected to the SIM card socket via the hollow portion. The first engaging member is fixed on the first aide of the base so as to hold the SIM card. The second engaging member is disposed on the second side of the base in an elastically deformable manner so as to hold the SIM card. The SIM card is easily disposed into or removed from the SIM card socket by means of the second engaging member deforming.

In another preferred embodiment, the base further includes a fixed portion connecting the connector. The fixed portion is formed with a hole, and the connector is formed with a block corresponding to the hole. The SIM card socket is fixed on the connector by insertion of the block into the hole.

BRIEF DESCRIPTION OF THE DRAWING

The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIGS. 1 a-1 b are schematic views of a SIM card socket as disclosed in a first embodiment of the invention;

FIGS. 2 a-2 d are schematic views showing a method for manufacturing the SIM card socket in FIGS. 1 a-1 b;

FIG. 3 is a schematic view of an electronic device with the SIM card socket in FIGS. 1 a-1 b;

FIGS. 4 a-4 d are schematic views showing a manner for inserting a SIM card into the electronic device in FIG. 3;

FIGS. 5 a-5 b are schematic views of a SIM card socket as disclosed in a second embodiment of the invention;

FIGS. 6 a-6 b are schematic views showing a variation of the SIM card socket in FIGS. 5 a-5 b;

FIGS. 7 a-7 b are schematic views of a SIM card socket as disclosed in a third embodiment of the invention;

FIG. 8 a is a schematic view of an electronic device with the SIM card socket in FIGS. 7 a-7 b; and

FIG. 8 b is a side view of the assembled electronic device in FIG. 8 a.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

FIGS. 1 a-1 b show a SIM card socket 10 as disclosed in a first embodiment of the invention. In this embodiment, the SIM card socket 10 includes a base 11, two first engaging members 12, a second engaging member 13, an isolation member 14, six first elastic members 15, a second elastic member 16, and two walls 17.

The base 11 is conductive, and is used as a basic component of the SIM card socket 10. The base 10 includes a first side 111, a second side 112 opposite to the first side 111, a third side 113, and a fourth side 114 opposite to the third side 113.

Each the first engaging member 12 is integrally formed on the first side 111 of the base 11, and is formed like a hook. Also, the first engaging members 12 are fixed relative to the bane 11 so that the first engaging members 12 are fixed on the first side 111 of the base 11. The second engaging member 13 is disposed on the second aide 112 of the base 11 in an elastically deformable manner, and includes a connecting portion 131 and a holding portion 132. The connecting portion 131 is connected to the second side 112 of the base 11. The holding portion 132 is integrally formed on the connecting portion 131, and may be cantilevered to move relative to the base 11. Also, the holding portion includes two hooks 132 a.

The isolation member 14 is disposed on the base 11, and may be made of isolation material such as plastic. Each first elastic member 15 is disposed and held in the isolation member 14 respectively, and is separated by the isolation member 14 to prevent the first elastic members 15 electrically connecting each other. The first elastic members 15 may be electrically connected to pads (no shown) on a SIM card 200 (shown in FIG. 4 a) disposed in the SIM card socket 10, acting as contacts.

The second elastic member 16 is integrally formed on the base 11. The walls 17 are formed on the third side 113 and the fourth side 114 of the base 11 respectively.

FIGS. 2 a-2 d are schematic views showing a method for manufacturing the SIM card socket of this embodiment. In this embodiment, the method includes the following steps. The conductive base 11 is firstly provided, and is formed by cutting via a press so as to include a plurality of protrusions 151 as shown in FIG. 2 a. The isolating member 14 is then formed on the conductive base 11 by injection molding so that the protrusions 151 are partially covered by the isolating member 14 as shown in FIG. 2 b. The protrusions 151 are subsequentially press molding into an inverted-V shape. At the same time, the conductive base 33 is bent so as to form the first engaging members 12, the second engaging member 13, the second elastic member 16, and the walls 17 by press molding as shown in FIG. 2 c. The protrusions 151 are finally cut 80 as to not connect each other, to form the first elastic members 15 as shown in FIG. 2 d.

It is noted that the thickness of the isolation member 14 is adjustable according to an angle at which the protrusion 151 is bent. A detailed description follows.

Manufacture of the SIM card socket 10 of the embodiment is simple, and the thickness of the SIM card socket 10 can be minimized.

FIG. 3 is a schematic view of an electronic device 100 with the SIM card socket 10 of this embodiment. The SIM card socket 10 is disposed on a body 110 of the electronic device 100. Referring to FIG. 3, assembly of the SIM card socket 10 of this embodiment on the electronic device 100 is simplified, since the body 110 of the electronic device 100 does not include any additional devices coordinating with the SIM card socket 10.

To insert the SIM card 200 into the SIM card socket 10 of the electronic device 100, one side of the SIM card 200 first abuts by the second engaging portion 13 as shown in FIG. 4 a. The SIM card 200 is then moved toward the second engaging portion 13 as shown in FIG. 4 b. The other side, near the first engaging portions 12, of the SIM card 200 is subsequentially pressed downward as shown in FIG. 4 c. The SIM card 200 is finally engaged with the first portion 12 as shown in FIG. 4 d by the elastic force of the second engaging portion 13.

To remove the SIM card 200 from the SIM card socket 10 of the electronic device 100, the SIM card 200 is firstly moved toward the second engaging portion 13 to disengage from the first engaging portions 12. At this time, the SIM card 200 is lifted upwardly by the second elastic member 16, and is removed.

By means of the SIM card socket 10 of this embodiment, the SIM card 200 is conveniently disposed in the electronic device 100. Furthermore, when the electronic device 100 is assembled with the SIM card socket 10 of this embodiment, manufacture is simplified with no need for additional devices to coordinate with the SIM card socket 10.

Second Embodiment

FIGS. 5 a-5 b show a SIM card socket 10 a as disclosed in a second embodiment of the invention. In this embodiment, the SIM card socket 10 a includes a base 11, two first engaging members 12, a second engaging member 13, an isolation member 14, six first elastic members 15 a, a second elastic member 16, and two walls 17. The components of this embodiment same as those of the first embodiment are given the similar labels, and their description in omitted.

This embodiment differs from the first embodiment in that all of the first elastic members is a (protrusions) extend in the same direction on the base 11, unlike the scheme of first embodiment where three of the first elastic members 15 extending in a first direction and the other three in a second direction opposite to thereto.

By means of the first elastic members 15 a, it is more convenient to manufacture the SIM card socket. Additionally, when the protrusions are bent to form the first elastic members 15 a, the angles thereof are adjustable as required.

Referring to FIGS. 6 a-6 b, since all of first elastic members 15 b extend in the same direction on the base 11, the angle of the first elastic members 15 b is adjustable as required. Thus, the thickness of an isolation member 14 b can be increased. As a result, the SIM card socket 10 b with the thicker isolation member 14 b is more easily manufactured.

Third Embodiment

FIGS. 7 a-7 b show a SIM card socket 10 c as disclosed in a third embodiment of the invention. In this embodiment, the SIM card socket 10 c includes a base 11 c, two first engaging members 12, a second engaging member 13, an elastic member 16, and two walls 17. It is noted that the components of this embodiment same as those of the first embodiment are given the similar labels, and their description is omitted.

This embodiment differs from the first embodiment in that the SIM card socket 10 c of this embodiment does not include elastic contact members.

The base 11 c includes a hollow portion 115 and a fixed portion 116. The fixed portion 116 is formed with a hole 116 a.

Referring to FIGS. 8 a-8 b, since the SIM card socket 10 c of this embodiment does not include elastic contact members, an electronic device 10 c, coordinated with the SIM card socket 10 c, includes a connector 120 thereon. The connector 120 is formed with a block 121 corresponding to the hole 116 a as shown in FIG. 8 b. The SIM card socket 10 c can be fixed on the connector 120 of the electronic device 100 c by inserting the block 121 into the hole 116 a.

As stated above, the SIM card socket 10 c of this embodiment can be applied in an electronic device with a connector, and assembly thereof is very convenient. It is understood that the connector may be a SIM connector.

While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. 

1-9. (canceled)
 10. A method for manufacturing a SIM card socket comprising: providing a conductive base with a plurality of protrusions; forming an isolating member on the conductive base, wherein the protrusions are partially covered by the isolating member; and cutting the protrusions so as to not connect with each other.
 11. The method as claimed in claim 10, further comprising: after forming the isolation member on the conductive base, bending the protrusions.
 12. The method as claimed in claim 11, wherein each protrusion is bent into an inverted-V shape.
 13. The method as claimed in claim 11, wherein the thickness of the isolation member is variable according to an angle at which the protrusion is bent.
 14. The method as claimed in claim 10, further comprising: after forming the isolation member on the conductive base, bending the conductive base to form a first engaging member.
 15. The method as claimed in claim 10, further comprising: after forming the isolation member on the conductive base, bending the conductive base to form a second engaging member.
 16. The method as claimed in claim 10, further comprising: after forming the isolation member on the conductive base, pressing the conductive base to form an elastic member.
 17. The method as claimed in claim 10, further comprising: after forming the isolation member on the conductive base, bending the conductive base to form a wall. 18-26. (canceled) 